DIFFERENTIATED INNOVATION
Hyperion designs, manufactures, and assembles advanced microelectronic systems.
Based in the United States, Hyperion is uniquely positioned as an end-to-end microelectronic systems provider. Our innovation addresses many technology and supply chain issues critical to the semiconductor industry. With deep domain expertise and combination of novel materials and processes, we are scaling microelectronic systems towards higher performance, lower power consumption, and increased density. Hyperion offers unparalleled system-level differentiations to our customers.
End-to-end microelectronics packaging solution provider, offering direct-to-end user service. Specializing in system-level packaging for high-performance computing and heterogeneously integrated systems. Offering manufacturing service for a wide array of market segments including; defense, aerospace, industrial, general-purpose client computing, and high-performance computing.
High-Density Interconnect
- Superior interconnect scalability
- Lower structural cost
- Accelerated lead time
Advanced Packaging Solutions
- Industry-first, True 3D point-to-point interconnect
- High-performance computing systems
- QCIA 2.X D® and QCIA 3D® architectures
System-Level Design
- State-of-the-art Chiplet and system-level design
- Wide range of technology nodes
- Heterogeneously integrated systems
We are bringing our unique material and photonic based manufacturing technology to market to unlock a whole new generation of advanced interconnect processes and architectures. Our QCP®️ process and 3D-structured, conversion-based technologies offer the microelectronic industry an unmatched scalability, manufacturing productivity and device performance. Contact us to learn more about our offering.
Our planned facilities feature a connected and highly automated manufacturing flow built on an intelligent and advanced engineering processes.
We strive to role model a sustainable and green manufacturing with operation designed to achieve Net Zero positive water Usage And 100% renewable Power consumptions.
Smart/Active/Chiplet
QCP® /QCIA 2.5D®/QCIA 3D®
Autonomously Guided Vehicles (AGV)
Augmented Reality
Blockchain
Machine Learning
Artificial Intelligence
Digital Twin
Full loop Digital Thread
100% Renewable Power
Carbon Emission Reduction
DIFFERENTIATED INNOVATION IN MICROELECTRONICS
Need More Information?
Email us at info@hyperiontech.us copy
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