HYPERION DELIVERS DIFFERENTIATED INNOVATION
WHAT IS HYPERION?
Hyperion Technologies is a post-fab, system level manufacturing foundry. Hyperion specializes in high-density interconnect semiconductor substrates, semiconductor Interconnect Fabrics™, and microelectronic system level design and integration. Our innovative fabrication approach addresses critical technology and supply chain challenges in the semiconductor industry. With deep domain expertise, state-of-the-art, fully automated fabrication, and novel materials and processes, we are scaling microelectronic systems for higher performance, lower power consumption, and increased density. Hyperion’s U.S based fabrication capability and capacity delivers unmatched lead time and supply chain security advantages. Hyperion technologies are system-level differentiators for our customers.
THE PEORIA PROJECT
Hyperion is breaking ground on a new U.S-based, fully-automated, semiconductor volume fabrication facility. Located in the heart of the Arizona semiconductor innovation cluster, the facility will produce high density interconnect substrates and chiplets Interconnect Fabrics™. This pivotal project will bolster the U.S semiconductor industry’s resilience and our nation’s economic and national security.
OUR CUSTOMERS
We offer semiconductor interconnect solutions to a wide array of market segments including:
ARTIFICIAL INTELLIGENCE
AEROSPACE AND DEFENSE
HIGH PERFORMANCE COMPUTING
NETWORKING AND TELECOMMUNICATIONS
AUTOMOTIVE
OUR SOLUTIONS
Products
- HDI semiconductor substrates
- Double sided and system level substrates 2.5D and 3D interposers and packaging solutions
- 3D chiplet Interconnect Fabrics™
- Fully integrated power delivery modules
Technology
- IC-substrate build up and core fabrication
- Hyperion Interconnect Fabric™ Technologies
- Hyperion Quantum Conversion Patterning (QCP®)
- Hyperion Quantum Conversion Integration Architecture (QCIA®)
- QCIA® 2.5D, QCIA® 3D and QCIA® Thermal
A LIGHTHOUSE FOR SUSTAINABILITY, AUTOMATED MANUFACTURING, AND INDUSTRY 4.0
Hyperion is a first-of-its-kind, fully automated, sustainable, and green substrate manufacturing fab in the United States. Hyperion substrate operations is designed to achieve net positive water usage, renewable power consumptions and zero land fill waste.
Next generation innovations bring our unique material and photonic based manufacturing technologies to market, unlocking a whole new generation of advanced interconnect processes and architectures for system level scaling. Our QCP® process and QCIA® interconnect architecture technologies offer the microelectronic industry scalability, manufacturing productivity and improved device performance.
HYPERION NEWSROOM
COMING SOON
HYPERION TECHNOLOGIES ANNOUNCES PLANS TO BUILD A HIGH-VOLUME SEMICONDUCTOR SUBSTRATE MANUFACTURING FACILITY IN PEORIA, ARIZONA
JOIN THE HYPERION TEAM
Dive into the dynamic world of semiconductors, where innovation knows no bounds. At Hyperion, we’re shaping the future by pushing the limits of microchip technology. Join our team and be part of groundbreaking advancements that impact everything from smartphones to renewable energy.