OUR COMPANY

Hyperion Technologies’ foundational offering includes full design and fabrication of integrated circuit substrates, full design and fabrication of chiplet Interconnect Fabrics™ (2.5D and 3D) as well as post fabrication and turnkey supply chain service. Headquartered in Arizona, Hyperion operates its businesses as an independent-merchant foundry serving the U.S.-based domestic semiconductor market across diverse client segments including computing devices, mobile devices, aerospace, defense, automotive, consumer, internet of things, data centers, high-performance computing, and network infrastructures.

COMPANY LEADERSHIP

Dr. Islam (Sam) Salama
President & CEO

Dr. Islam Salama (Sam) is a technology and business executive with 20+ years of experience in the semiconductor industry. He is currently the chief executive at Hyperion Technologies, a U.S. based microelectronics systems manufacturer. Prior to Hyperion, Dr. Salama was a Vice President and General Manager with Intel Corporation, overseeing manufacturing, operations, and supply chain management for substrates, with a multibillion annual P&L. His organization led a network of eighteen global high-volume manufacturing fabs producing more than 1B units annually across Intel and its foundry products. In addition to internal high-volume manufacturing, his organization managed operations of an expansive global subcontract manufacturing ecosystem (>100 OEMs).  

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Dr Salma is leading the team to establish Hyperion as the first U.S.-based, independent merchant microsystem foundry. Over the course of 2 years, he drove the enterprise valuation to >$60M, established a strong executive team, built an innovative IP portfolio, launched an industry first 3D interconnect architecture/process, secured multiple joint-venture and cross-licensing agreements, delivered MVP prototypes to global customers, and secured manufacturing capacity partnerships. Under his leadership, Hyperion is executing a plan to establish a $2B+ world class fabrication facility within the nation’s leading edge semiconductor cluster in Arizona.  

Dr Salama is a global value creator, igniting business growth, driving productive and efficient operations, establishing new ventures and productizing multiple industry-first technologies. In addition to his executive role, Dr Salama is a board member at 3 semiconductor and advanced manufacturing companies. He serves on the advisory board of two global investment companies. Dr Salama is an elected fellow and trustee with the Laser Institute of America. He authored >150 patents, published >30 technical articles, book chapters, and industry reviews. As an influential leader, he is a frequent keynote speaker and a thought leader at multiple international forums and organizations.  

WHAT IS ADVANCED PACKAGING?

Microchips power many of today’s technologies. These chips, mostly made of silicon, are essential for things like AI, 5G, and self-driving cars.

Imagine microchips as tiny brains packed with functions. In the past, all the functions were crammed onto one chip. But now, instead of one chip doing everything, we’re using multiple smaller ones referred to a chiplets. To build a fully functioning semiconductor device, chiplets need to be reaggregated. This takes place using Interconnect Fabrics™ and high-density interconnect semiconductor substrates through advanced packaging. It’s like building a puzzle, where each piece has its own job, and they all fit together perfectly.

This advanced packaging makes our devices faster, more efficient, and less expensive. However, it’s tricky to make these smaller pieces and get them to fit together just right. We’re working on solutions, like using better materials, novel fabrication approaches and clever designs, to overcome these challenges.

The way we make and use microchips is changing, opening up new opportunities for better technology in the future.

GLOBAL SUPPLY CHAIN INSECURITY

The semiconductor Industry is growing toward  $1T by 2030. The demand for semiconductors has surged in various sectors such as automotive, consumer electronics, and healthcare, driven by trends like the proliferation of smartphones, the rise of electric vehicles, and the adoption of Internet of Things (IoT) devices.

The manufacturing of semiconductors involves a complex global supply chain with multiple stages of production spread across different countries. Any disruption such as natural disasters at one stage can have cascading effects on the entire supply chain.

Currently, a significant portion of semiconductor manufacturing is concentrated in a few countries, particularly Taiwan, South Korea, and China. This concentration makes the supply chain vulnerable to disruptions caused by regional conflicts, natural disasters, or political instability.

Addressing these challenges requires collaboration among governments, industry stakeholders, and semiconductor manufacturers to improve resilience, diversify supply chains, and invest in research and development to develop new technologies and manufacturing processes.

Hyperion’s commitment to meeting surging demand, streamlining its supply chain, reducing dependence on concentrated overseas production, and fostering collaboration and innovation position us as a key player in addressing the challenges facing the semiconductor industry and ensuring a secure and resilient supply chain for its customers.

TECHNOLOGY INFLECTION

Semiconductor technology is at an inflection point as Moore’s law progresses and traditional scaling slows down. To continually enhance processor performance at yield, the integration of chiplets and heterogenous integration through packaging substrate has become a prevailing trend in semiconductors. Hyperion’s Peoria Project is an investment in a fully domestic, U.S.-based substrate manufacturing operation that not only addresses the present need and acute vulnerability of the supply chain, but also offers a rare opportunity to leapfrog into technological leadership.

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