SERVICES
At Hyperion Technologies, we specialize in providing a comprehensive suite of services that go beyond conventional substrate manufacturing. We work in collaboration with substrate equipment, memory, and materials suppliers across key technology domains. Through joint development projects and intense engineering collaboration, we provide total packaging solutions focusing on technology differentiation, competitive total cost of ownership, accelerated time-to-volume, and time-to-market.
From the concept to the final stages of production, Hyperion offers support at every phase of semiconductor chip.
ADVANCED INTERCONNECT SOLUTION SERVICES
INTEGRATED PACKAGING TURNKEY SERVICES
IC SUBSTRATE DESIGN, FABRICATION, TESTING, AND RELIABILITY EVALUATION
We offer full design and fabrication of integrated circuit substrates and chiplet interconnect fabrics (2.5D and 3D). Our unique ability to offer co-optimized interposer and substrate fabrication provides quick solutions for advanced packaging integration issues. Our U.S. domestic substrate and interposer offering is the first of its kind, servicing our aerospace and defense customers.
POWER DELIVERY NETWORK DESIGN, MODULE FABRICATION AND TESTING
At Hyperion, we know that devices are becoming more complex and power-hungry. As Power Delivery Network (PDN) experts, we have the knowledge and tools to meet your most demanding design requirements. Our carefully controlled fabrication processes ensure that we can create the physical components of your most complex design. We’ll also test functionality and check for any potential issues to maximize your PDN’s effectiveness.